High Thermal Conductivity Aluminum Nitride Ceramics
AlN based ceramic material possesses good thermal conductivity, reliable electrical insulation, low dielectric constant and consumption, high strength and extraordinary machinability.
Aluminum nitride | AlN120 | AlN140 | AlN160 | AlN180 |
Color | Dark Gray
| Dark Gray
| Translucent Medium gray
| Translucent Medium gray |
Surface roughness, Ra (μｍ)
| 0.6max | 0.6max | 0.5max | 0.5max |
Density (g/cm3) | 3.25 | 3.26 | 3.33 | 3.33 |
Flexural strength MPa) | >320 | >300 | >300 | >300 |
Compressive Strength (GPa) | 2.1 | 2.1 | 2.0 | 2.0 |
Fracture toughness (MPa m1/2) | 3.30±0.05 | 3.30±0.05 | 3.35±0.05 | 3.35±0.05 |
Young’s modulus (GPa) | 300 | 300 | 310 | 310 |
Thermal conductivity (W/mK) | 120±10% | 140±10% | 160±10 | 180±10 |
Coeff. of thermal expansion (10-6 K-1)RT- 100℃ | 3.6 | 3.6 | 3.6 | 3.6 |
Volume resistivity Ωcm) | >1012 | >1012 | >1013 | >1013 |
Dielectric strength (KV/mm) | ≥18 | ≥18 | ≥20 | ≥20 |
Dielectric constant @1MHz) | 9.0±10% | 9.0±10% | 9.0±10% | 9.0±10% |
Melting point | 2500℃ | 2500℃ | 2500℃ | 2500℃ |
Applications
It can be used for fabricating high thermal conductivity magnetism-free skeleton materials, microwave dielectric materials, high-temperature resistant, insulating and erosion-resistant structural ceramic materials and products.
(1) Circuit substrates of power semiconductor modules,power microwave device and IC packages
(2) Heat sink materials for power transisitors,thyristors,LDs and LEDs
(3) Electronic device and semiconductor refrigerations
